Article Number : 2011 |
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| Date | 5/24/2007 8:32:22 AM |
| Written By | LGM & Associates Technical Flooring Services |
| View this article at: | //floorbiz.com/BizResources/NPViewArticle.asp?ArticleID=2011 |
| Abstract | Denver—W.F. Taylor Co. has introduced its latest development in Next Generation technology, the MS-Plus Wood Flooring Adhesive. The product combines Taylor’s patented Meta-tec technology with Telechelic Modified Silane Polymer chemistry... |
| Article | Denver—W.F. Taylor Co. has introduced its latest development in Next Generation technology, the MS-Plus Wood Flooring Adhesive. The product combines Taylor’s patented Meta-tec technology with Telechelic Modified Silane Polymer chemistry. This moisture cure adhesive represents a significant advancement, noted Jack Raidy Jr., Taylor’s president and CEO. The product offers improved early green strength, excellent moisture resistance and a strong, elastic bond for the installation of engineered and solid wood flooring. The product is also Greenguard tested and approved. According to Raidy, Taylor wanted to offer advancements in performance and environmental soundness characteristics “that are already so successful for our Meta-tec #2071, but add a product entry to the 100% solids moisture cure class of adhesives.” Taylor plans to continue offering #2071 Tuff-Lok X-Link Wood Flooring Adhesive along with MS-Plus, Raidy noted. For more information, call 951.360.6677, ext. 100. |